Endicott Interconnect Technologies' Wire Bond Product Launched into Space
Endicott, NY - October 30, 2007
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Bondfinger pitches of 118µm enable shorter wire lengths, die shrinkage or
higher I/O density
Allows a reduced distance between the edge of the die and the bondfinger
Ability to support more voltage and ground connections
Shorter Wire Bond wires, lower loop heights,
and increased V/G connections result in significantly reduced electrical parasitics of
an assembled module
Provides the ability to migrate from a chip-up package to a same size cavity package as chip power requires
Single part number substrates can accommodate
a greater chip part number mix, providing increased I/O capability
Pick and place compatible
Standard JEDEC body sizes and testing
Single tier cavity
Single layer or multi layer cross sections
Support for standard chip-up or cavity for added thermal performance
Available in BT, Polyimide or FR4
dielectric materials
MARKET:
Pervasive Computing
END USE:
Video Game
PRODUCT:
Wire Bond PBGA
27mm body
256 I/O
Cavity Down, 1 layer
142 Signals, strip line design (Gnd/Sig/Pwr)
VOLUME:
> 10M pieces/year
MARKET:
Telecommunications
END USE:
Fiber Optic Interface, up to 16Gb/s
PRODUCT:
Wire Bond PBGA
33mm body
304 BGA I/O
22 differential pairs
5.5 watts
VOLUME:
< 10K pieces/year
MARKET:
Military
END USE:
Global Positioning System
PRODUCT:
Wire Bond PBGA
35mm body
10 layer
Build up with stacked vias
3mil lines/spaces
Core vias 8mil mechanical drilled
BU vias 4mil CO2 laser drilled
VOLUME:
30K pieces/year
EI’s organic Wire Bond plastic ball grid array (PBGA)
carriers provide leading edge, system-in-package (SiP) or
single-chip module (SCM) precision packaging solutions for
semiconductor technology. Superior electrical performance, combined
with materials that are matched to the printed circuit board, allow
Wire Bond PBGA carriers to deliver high overall performance and
field reliability.
Applications
If you’re looking to extend the use of your existing Wire Bond infrastructure, these PBGA carriers are available in both chip-up and cavity configurations.
The chip-up design is extremely
economical and targets lower power applications while the cavity
package allows the backside of a die to be thermally connected to a
heat spreader. This configuration is mounted to a printed circuit
board with the heat spreader exposed, allowing easy attachment of a
heat sink and providing excellent thermal performance.
If you’re looking to extend the use of your existing Wire Bond infrastructure, these PBGA carriers are available in both chip-up and cavity configurations.
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