IEEE Transactions on Electronics Packaging Manufacturing 2008: Laser Micromachining of Barium Titanate-Epoxy Nanocomposite-based Flexible/Rollable Capacitors: New Approach for Making Library of Capacitors
Circuit World 2008: Nano- and Micro-filled Conducting Adhesives for Z-axis Interconnections: New Direction for High-Speed, High-Density, Organic Microlectronics Packaging
IPC Printed Circuits Expo, APEX & the Designers Summit 2008: Manufacture and Permformance of a Z-interconnect HDI Circuit Card
ITHERM 2008: A Study of the Thermal Characterization of a High-Performance Flip Chip Package
Electronic Components and Technology Conference (ECTC) 2008: Laser Processing of 3-D Structures for Embedded and Integrated Components: An Application of Flexible and Printable Nanomaterials in Microelectronics
Electronic Components and Technology Conference (ECTC) 2008: Manufacture and Ultra-High Frequency Performance of an LCP-based, Z-interconnect, Flip Chip Package
Electronic Components and Technology Conference (ECTC) 2008: Resin Coated Copper Capacitive (RC3) Nanocomposites for Multilayer Embedded Capacitors
IPC Printed Circuits Expo, APEX & the Designers Summit 2008: Printable Nanocomposites for Electronic Packaging
IMAPS 40th Symposium on Microelectronics 2007: Manufacture and Characterization of a Novel Flip Chip Package Z-interconnect Stackup with RF Structures
Electronic Components and Technology Conference (ECTC) 2007: Electrical Performance of an Organic, Z-Interconnect, Flip-Chip Substrate
Electronic Components and Technology Conference (ECTC) 2007: Influence of Nanoparticles, Low Melting Point Fillers and Conducting Polymers on Electrical, Mechanical and Reliability Performance of Micro-Filled Conducting Adhesives for Z-axis Interconnections
Electronic Components and Technology Conference (ECTC) 2007: Printable Nanocomposites for Advanced Organic Packaging
Electronic Components and Technology Conference (ECTC) 2007: Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors
IMAPS Military, Aerospace, Space & Homeland Security (MASH) Workshop 2007: Design Challenge to Integrate High Perf Pkg into High-end ASIC Strategic Space Based Application
IMAPS 39th Annual Symposium on Microelectronics 2006: Improvement of Organic Packaging Thermal Cycle Performance Measurement
IMAPS Military, Aerospace, Space & Homeland Security (MASH) Workshop 2006:
High Reliability Products - What does it Take? - A Test Perspective
Electronic Components and Technology Conference (ECTC) 2006: Thermal Enhancement of Systems using Flip Chip Packages with an Alternate Cooling Path through the PCB
Electronic Components and Technology Conference (ECTC) 2006:
Simulation and Measurement of High Speed Serial Link Performance in Dense, Thin Core Flip Chip Package
Electronic Components and Technology Conference (ECTC) 2006:
AC Coupled Interconnect using Buried Bumps for Laminated Organic Packages
Industrial Engineers Research Conference (IERC) 2006:
Real-Time Yield Monitoring Through ERP Systems
Electronic Components and Technology Conference (ECTC) 2005:
Proof is in the PTH - Assuring Via Reliability from Chip Carriers to Thick Printed Wiring Boards
Advanced Packaging Materials Symposium 2005:
Design, Fabrication and Reliability Assessment of Embedded Resistors and Capacitors on Multilayered Organic Substrates
DesignCon East 2005:
Meeting the PWB Needs for High Speed Data Transmission
International Conference and Exhibition on Device Packaging 2005:
Wireability Comparison of Flip Chip Substrates as a Function of Chip Design and Substrate Capability
International Reliability Physics Symposium 2005:
Testing to Eliminate Reliability Defects from Electronic Packages
Electronic Components and Technology Conference (ECTC) 2005:
PWB Solutions for High Speed Systems
Electronic Components and Technology Conference (ECTC) 2005:
Flip Chip Assembly Challenges Using High Density, Thin Core Carriers
Electronic Components and Technology Conference (ECTC) 2005:
Thermal Performance of a Thin High Interconnect Density Organic Substrate for Flip-Chip Applications
For more technical info from EI,
| Press Releases | Events Calendar | Technical Papers | Articles | Literature | Case Studies |