EI’s semiconductor packages offer organic substrates designed to provide superior electrical performance along with high reliability. These are very dense, light and thin packages and are available as single chip or system-in-package (SiP) solutions.

Ideal when…

Significant weight and size reductions are achieved when compared to ceramic packages, providing real value for military and medical applications.

Superior electrical performance over ceramic packages, proving beneficial for high bandwidth routers and switch applications.

Measurable reliability performance improvement verses ceramic packages, which is great for large die and large body sizes such as FPGA’s and ASIC’s.



First Level Semiconductor Packaging Assembly

EI combines advanced process and product development with manufacturing to provide prototype to volume production of flip chip and wire bond packaging assemblies.



Flip Chip Attach Expertise

Hi melt, eutectic, Sn cap C4, Pb-free
Low alpha Sn/Pb solder
Chip join down to 150 micron pitch
Die sizes placed to 25x26mm
Flux chemistries/dispensing
Underfills
BGA attach (Eutectic, Pb-free)
PGA attach
Thermal adhesive
Heat spreader/Lid attach
Heatsink attach
100 micron pitch solder screening
COB
MCM packaging
Solder volume measurements
CSAM acoustic imaging
X-ray

Equipment Process Capabilities

Substrate Fluxing
Asymtek Century C-730 fluxer
Water soluble & noclean fluxes
Solder paste screening for SMT (MPM UP3000)

Component Placement
Universal GSM placement tool
Large die (>25mm) down to small 0402 SMT
X-ray to verify alignment

Solder Reflow
Vitronics XPM820 reflow oven
Nitrogen reflow for eutectic Sn/Pb and Pb-free soldering

Flip-Chip Wash/Flux Cleaning
Electrovert Aquastorm 200 for water soluble flux cleaning
Non-aqueous cleaning for noclean flux cleaning

Underfill Encapsulation
Surface treatment with plasma
Cam/Alot S3600 underfill dispense tool
Large die underfilling & component encapsulation
BGA underfilling
CSAM inspection to detect presence of voids

Coverplate Attach
Dispense of silicone adhesive using Cam/Alot S3600
Placement of coverplate using Universal GSM placement tool

BGA Ball Attach
Cam/Alot Matrixx tool
25mil to 30mil diameter solder balls (eutectic & lead free)
1.0 and 1.27mm pitches
Up to 52.5mm body size
Cu-OSP, NiAu, and pre-soldered pad surface finishes
BGA ball shear

Part Marking
Markem Q2001
Black or white text & logos with serialization

Coplanarity
SVS 8300
Incoming laminate and final module coplanarity

Test
Opens/shorts testing Genrad 2282

Assembly Characterization/FA Capabilities

Complete range of
optical microscopes for inspection of:

Solder joints
Underfill fillet and other parameters
BGA balling quality
Final module quality

CR Technology CRX-2000 X-Ray
Flip-chip solder joint alignment, bridging & voiding
BGA ball voiding & bridging

Die removal Tools
100% flip-chip joint inspection

Micro-sectioning Tools
Solder joint inspection of wetting, voiding, intermetallic growth, etc.
Module construction analysis

Sonoscan System D6000 - CSAM
Underfill void detection
Delamination detection after module stressing

SVS 8300
Component solder paste volume measurement
Incoming laminate flatness
Module flatness

Complete FA capabilities on site at EI
SEM, DSC, XPS, AUGER, EDS, TMA, DMA, Thermal analysis, Modeling, Shadow Moiré, etc…

Assembly Characterization/FA Capabilities



Wire Bond Expertise

Ball bonding 1 mil diameter Au wire
Pitches down to 57mm on 600+ wire package
Production qualified for military applications
Die sizes to 16mm square
Ribbon bonding packages and cards to 12”
Al ribbon bonding available
Coplanarity measurements

Wire Bonding Equipment

Kulicke & Soffa 8020 ball bonder
Hughes 2460 ball bonders
Westbond 3476 manual ribbon bonder
Dage wirepull and bond shear to Mil Spec