Endicott Interconnect Technologies
Endicott Interconnect Technologies
Endicott Interconnect Technologies
Endicott Interconnect Technologies
Endicott Interconnect Technologies
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Temperature & humidity bias (THB)
25 Chambers, 24 x 28” panels

Wet thermal shock

Moisture sensitivity (popcorning)

Highly accelerated stress test (HAST)

Ionic contamination

Failure isolation & analysis
   Cross & flat sections
   Acoustic microscopy
   SEM, XPS, AES, IR

IPC & JEDEC standards

Accelerated thermal cycling (ATC)

High temperature storage (HTS)

Current induced thermal cycling (CITC)

Shock & vibration testing

Autoclave (pressure cooker)