Endicott Interconnect

Semiconductor Packaging | Printed Circuit Boards | Complex Assembly Solutions | Precision Equipment Manufacturing

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Features

Large PCBs (up to 26”x36”) with high I/O and dense BGA footprints using High Tg FR4, polyimide and low loss (low Df/low Dk)/high performance materials

High density wireability options using blind and buried vias, fine lines and spaces, thin cores and microvias

A wide variety of surface finishes from OSPs to multiple metal surface finishes (including SnPb, Pd, NiAu and Ag)

Precision layer to layer registration

Plating aspect ratios up to 20:1 (10 mil drilled via)

Design assistance available from application engineers specializing
in PCB solutions

Industry standard testing combined with extended testing and advanced techniques for high reliability

Literature

EI PCB Design Guidelines

Printed Circuit Boards Specifications Chart

Technical Papers

“High Capacitance, Large Area, Thin Film, Nanocomposite-Based Embedded Capacitors” presented at Electronic Components and Technology Conference (ECTC) 2006. click here

“Proof is in the PTH – Assuring Via Reliability from Chip Carriers to Thick Printed Wiring Boards” presented at Electronic Components and Technology Conference (ECTC) 2005. click here

“Meeting the PWB Needs for High Speed Data Transmission” presented at DesignCon East 2005. click here

High Quality, High Density, High Reliability

At the forefront of printed circuit board development and manufacturing for more than 40 years, EI delivers high quality, high density, high layer count PCBs that provide long term performance.

We offer a total solution for your PCB fabrication needs, with physical design and modeling, technology development, applications engineering, quality engineering, field reliability simulation and analysis and after-sales support all under one roof. We can help you achieve shorter time-to-market cycles on new products, superior product performance and the competitive edge you need.

Applications

Our cost effective PCBs are a great solution for mission critical and high performance applications found in defense & aerospace, communications & computing, semiconductor, advanced test equipment, and medical industries. We produce PCBs found in active and logic applications as well as passive backplanes.