Endicott Interconnect Technologies
Design and Prototype Services
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Flip Chip HyperBGA and Dense Core

Wirebond PBGA

High Performance PCB/PCBA
We provide applications engineering, physical and mechanical design support and services for all EI business units. Our Design and Applications Engineering team, are the technical bridge connecting customers to internal operations at EI. They work closely with you on your design and application needs, ensuring manufacturable end product, and then map our capabilities and technologies to optimize performance and cost.

In-house designers specializing in PCB, PCB assembly, semiconductor packaging and integrated systems ensure designs remain confidential and adhere to performance and manufacturability standards.


Semiconductor packages are among the most complex and dense in the industry today.


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Physical Design Tools

Mechanical Design Tools

Endicott Interconnect Technologies