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Technical Papers Presented at Electronic Components and Technology Conference (ECTC) 2006. “Thermal Enhancement of Systems using Flip Chip Packages with Alternate Cooling Path through the PCB” click here “Simulation and Measurement of High Speed Serial Link Performance in Dense, Thin Core Flip Chip Package” click here |
Semiconductor Packaging
The
semiconductor chip represents high technology, but silicon advances
alone are only partially responsible for the electronics
revolution. In order to make them work, semiconductor chips need to
be connected to and protected from the outside world. That’s
where EI comes in. We’ve developed and manufactured innovative
organic semiconductor packages that can be found in many of the
world’s best-know electronic brands. EI offers proven,
validated solutions that can help you reduce risk, speed time to
market and reduce cycle times.
Increases in semiconductor circuit density poses interconnect challenges to the thermal, mechanical, and electrical integrity of the packaged device. EI’s semiconductor packaging technology is designed to support these new and advancing technologies so that gains made at the wafer level are not lost or
compromised at the system level.
Increases in semiconductor circuit density poses interconnect challenges to the thermal, mechanical, and electrical integrity of the packaged device. EI’s semiconductor packaging technology is designed to support these new and advancing technologies so that gains made at the wafer level are not lost or
compromised at the system level.