Wire Bond PBGA Semiconductor Packaging

Semiconductor Packaging | Printed Circuit Boards | Complex Assembly Solutions | Precision Equipment Manufacturing

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Features

Bondfinger pitches of 118µm enable shorter wire lengths, die shrinkage or
higher I/O density

Allows a reduced distance between the edge of the die and the bondfinger

Ability to support more voltage and ground connections

Shorter Wire Bond wires, lower loop heights,
and increased V/G connections result in significantly reduced electrical parasitics of
an assembled module

Provides the ability to migrate from a chip-up package to a same size cavity package as chip power requires

Single part number substrates can accommodate
a greater chip part number mix, providing increased I/O capability

Pick and place compatible

Standard JEDEC body sizes and testing

Single tier cavity

Single layer or multi layer cross sections

Support for standard chip-up or cavity for added thermal performance

Available in BT, Polyimide or FR4
dielectric materials

Literature

Wire Bond PBGA Specification Chart

MARKET:
Pervasive Computing

END USE:
Video Game

PRODUCT:
Wire Bond PBGA

27mm body

256 I/O

Cavity Down, 1 layer

142 Signals, strip line design (Gnd/Sig/Pwr)

VOLUME:
> 10M pieces/year

MARKET:
Telecommunications

END USE:
Fiber Optic Interface, up to 16Gb/s

PRODUCT:
Wire Bond PBGA

33mm body

304 BGA I/O

22 differential pairs

5.5 watts

VOLUME:
< 10K pieces/year

MARKET:
Military

END USE:
Global Positioning System

PRODUCT:
Wire Bond PBGA
35mm body
10 layer

Build up with stacked vias

3mil lines/spaces

Core vias 8mil mechanical drilled

BU vias 4mil CO2 laser drilled

VOLUME:
30K pieces/year

High Performance Packaging for Wire Bond Die

EI’s organic Wire Bond plastic ball grid array (PBGA) carriers provide leading edge, system-in-package (SiP) or single-chip module (SCM) precision packaging solutions for semiconductor technology. Superior electrical performance, combined with materials that are matched to the printed circuit board, allow Wire Bond PBGA carriers to deliver high overall performance and field reliability.

Applications

If you’re looking to extend the use of your existing Wire Bond infrastructure, these PBGA carriers are available in both chip-up and cavity configurations.

Availbale in Cavity Down & Chip Up

The chip-up design is extremely economical and targets lower power applications while the cavity package allows the backside of a die to be thermally connected to a heat spreader. This configuration is mounted to a printed circuit board with the heat spreader exposed, allowing easy attachment of a heat sink and providing excellent thermal performance.