Semiconductor Packaging | Printed Circuit Boards | Complex Assembly Solutions | Precision Equipment Manufacturing

| Literature |
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EI PCB Design Guidelines Printed Circuit Boards Specifications Chart |
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Technical
Papers “High Capacitance, Large Area, Thin Film, Nanocomposite-Based Embedded Capacitors” presented at Electronic Components and Technology Conference (ECTC) 2006. click here “Proof is in the PTH – Assuring Via Reliability from Chip Carriers to Thick Printed Wiring Boards” presented at Electronic Components and Technology Conference (ECTC) 2005. click here “Meeting the PWB Needs for High Speed Data Transmission” presented at DesignCon East 2005. click here |
High Quality, High Density, High Reliability PCB Fabrication
We have been at
the forefront of printed circuit board development and
manufacturing for years. EI delivers high quality,
high density, high layer count PCBs that provide long term
performance. ![]() We offer a total solution for your PCB fabrication needs, with physical design and modeling, technology development, applications engineering, quality engineering, field reliability simulation and analysis and after-sales support all under one roof. We can help you achieve shorter time-to-market cycles on new products, superior product performance and the competitive edge you need. Applications ![]()
Our cost effective PCBs are a great solution for mission critical and high performance applications found in defense & aerospace, communications & computing, semiconductor, advanced test equipment, and medical industries. We produce PCBs found in active and logic applications as well as passive backplanes. |





