EI’s CoreEZ™ semiconductor packaging utilizes the HyperBGA^® manufacturing platform to offer a thin core build-up flip chip package with very dense core vias using a cost sensitive material set. The core via density provides 199 micron via-to-via core pitch resulting in an essentially coreless structure. High core via density is achieved using smaller pads and the same 50 micron laser drilled holes used in producing HyperBGA^® to unblock wiring channels through the core. This enables CoreEZ™ to provide up to 2 times the number of signal layers as a standard build-up package that uses mechanically drilled core vias with large capture pads. The end result is an extremely cost effective solution that allows full strip line signal layers on both sides of the core.




Component cost is further reduced by enabling die shrink through die pad pitch reduction down to 150 microns. In addition, the thinness of the core provides improved power distribution and the ability to dissipate chip thermal power into the PCB.

Applications

CoreEZ™ is an excellent choice for applications requiring low cost build-up materials along with high reliability, performance and wireability. It is also nicely suited to aerospace applications requiring radiation tolerance.