IMAPS 2008: Migrating PWB Assemblies in System-in-Package

IMAPS 2008: Fabrication and Electrical Performance of Z-Axis Interconnections: An Application of Nano-Micro-Filled Conducting Adhesives

IEEE Transactions on Electronics Packaging Manufacturing 2008: Laser Micromachining of Barium Titanate-Epoxy Nanocomposite-based Flexible/Rollable Capacitors: New Approach for Making Library of Capacitors

Circuit World 2008: Nano- and Micro-filled Conducting Adhesives for Z-axis Interconnections: New Direction for High-Speed, High-Density, Organic Microlectronics Packaging

IPC Printed Circuits Expo, APEX & the Designers Summit 2008: Manufacture and Permformance of a Z-interconnect HDI Circuit Card

ITHERM 2008: A Study of the Thermal Characterization of a High-Performance Flip Chip Package

Electronic Components and Technology Conference (ECTC) 2008: Laser Processing of 3-D Structures for Embedded and Integrated Components: An Application of Flexible and Printable Nanomaterials in Microelectronics

Electronic Components and Technology Conference (ECTC) 2008: Manufacture and Ultra-High Frequency Performance of an LCP-based, Z-interconnect, Flip Chip Package

Electronic Components and Technology Conference (ECTC) 2008: Resin Coated Copper Capacitive (RC3) Nanocomposites for Multilayer Embedded Capacitors

IPC Printed Circuits Expo, APEX & the Designers Summit 2008: Printable Nanocomposites for Electronic Packaging               

IMAPS 40th Symposium on Microelectronics 2007: Manufacture and Characterization of a Novel Flip Chip Package Z-interconnect Stackup with RF Structures

Electronic Components and Technology Conference (ECTC) 2007: Electrical Performance of an Organic, Z-Interconnect, Flip-Chip Substrate

Electronic Components and Technology Conference (ECTC) 2007: Influence of Nanoparticles, Low Melting Point Fillers and Conducting Polymers on Electrical, Mechanical and Reliability Performance of Micro-Filled Conducting Adhesives for Z-axis Interconnections 

Electronic Components and Technology Conference (ECTC) 2007: Printable Nanocomposites for Advanced Organic Packaging

Electronic Components and Technology Conference (ECTC) 2007: Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors

IMAPS Military, Aerospace, Space & Homeland Security (MASH) Workshop 2007:                                                                     Design Challenge to Integrate High Perf Pkg into High-end ASIC Strategic Space Based Application

IMAPS 39th Annual Symposium on Microelectronics 2006: Improvement of Organic Packaging Thermal Cycle Performance Measurement

IMAPS Military, Aerospace, Space & Homeland Security (MASH) Workshop 2006:
High Reliability Products - What does it Take? - A Test Perspective

Electronic Components and Technology Conference (ECTC) 2006: Thermal Enhancement of Systems using Flip Chip Packages with an Alternate Cooling Path through the PCB

Electronic Components and Technology Conference (ECTC) 2006:
Simulation and Measurement of High Speed Serial Link Performance in Dense, Thin Core Flip Chip Package

Electronic Components and Technology Conference (ECTC) 2006:
AC Coupled Interconnect using Buried Bumps for Laminated Organic Packages

Industrial Engineers Research Conference (IERC) 2006:
Real-Time Yield Monitoring Through ERP Systems

Electronic Components and Technology Conference (ECTC) 2005:
Proof is in the PTH - Assuring Via Reliability from Chip Carriers to Thick Printed Wiring Boards

Advanced Packaging Materials Symposium 2005:
Design, Fabrication and Reliability Assessment of Embedded Resistors and Capacitors on Multilayered Organic Substrates

DesignCon East 2005:
Meeting the PWB Needs for High Speed Data Transmission

International Conference and Exhibition on Device Packaging 2005:
Wireability Comparison of Flip Chip Substrates as a Function of Chip Design and Substrate Capability

International Reliability Physics Symposium 2005:
Testing to Eliminate Reliability Defects from Electronic Packages

Electronic Components and Technology Conference (ECTC) 2005:
PWB Solutions for High Speed Systems

Electronic Components and Technology Conference (ECTC) 2005:
Flip Chip Assembly Challenges Using High Density, Thin Core Carriers

Electronic Components and Technology Conference (ECTC) 2005:
Thermal Performance of a Thin High Interconnect Density Organic Substrate for Flip-Chip Applications

IEEE 2003: Modeling and Simulation of 12.5 Gb/s on a HyperBGA Package