As the technology of end applications advances rapidly, so do the needs of advanced test equipment. In many cases, the test equipment must perform even beyond the levels of the end application. Best-in-class signal integrity, signal speed, thermal performance, quality and reliability are critical to ensuring confidence in the measurements provided by the latest test equipment. The ATE market uniquely struggles with the need to exceed the performance of the end applications while producing volumes that might be as low as a few systems of a given configuration.

Our small lot manufacturing capabilities and high performance solutions can help you solve this problem. We provide customized manufacturing solutions, integrated services to manage your products throughout their life cycle, comprehensive supply chain management and access to leading edge technologies. Our engineering and design expertise includes radio frequency, mechanical, electrical, chemical, software and thermal modeling, design and PCB layout and extensive reliability testing.

By utilizing EI for your electronic packaging solutions, you can obtain the advanced performance solutions of the end applications, while leveraging our unique ability to meet the needs of low volume customers.

- Semiconductor test equipment
- Test probes
- Lab equipment
- Communications testers
- Custom simulation computers