EI's
advanced lab services is a powerful combination of the people,
equipment, and expertise capable of providing materials
characterization and failure analysis.
Materials analysis is critical when determining the root cause of failures that occur either during the development of a new technology or process or related to manufacturing of existing product. We have a broad range of material science, surface chemistry and microscopy skills and techniques which may be used to solve electronic packaging issues. EI provides insight into yield, quality and reliability issues. Our team of engineers and technicians provide materials characterization and failure analysis to the EI Development, Manufacturing and Quality team so that the best materials and processes are utilized, providing the highest quality electronic packaging solutions at the lowest possible cost.
Thorough understanding of materials, process interactions and likely failure mechanisms allow us to support EI products, assuring our customers the highest quality and reliability. Metallurgy, material science, chemistry and engineering principles are combined with light microscopy, electron microscopy, surface analysis, metallography and mechanical testing to provide answers to the challenges in producing these high tech electronic packaging products.
Materials analysis is critical when determining the root cause of failures that occur either during the development of a new technology or process or related to manufacturing of existing product. We have a broad range of material science, surface chemistry and microscopy skills and techniques which may be used to solve electronic packaging issues. EI provides insight into yield, quality and reliability issues. Our team of engineers and technicians provide materials characterization and failure analysis to the EI Development, Manufacturing and Quality team so that the best materials and processes are utilized, providing the highest quality electronic packaging solutions at the lowest possible cost.
Thorough understanding of materials, process interactions and likely failure mechanisms allow us to support EI products, assuring our customers the highest quality and reliability. Metallurgy, material science, chemistry and engineering principles are combined with light microscopy, electron microscopy, surface analysis, metallography and mechanical testing to provide answers to the challenges in producing these high tech electronic packaging products.
